About Sinopack

HE BEI SINOPACK ELECTRONIC TECH CO.,LTD ，

a company has background in ceramic packaging for more than 40 years, devotes to the research and production of multilayer ceramic packages.
● Perfect Facilities——equipped with advanced production technology and equipment, modern and scientific management system, advanced and accurate quality testing equipment, formed a perfect quality assurance system.
● Strong production capacity——6000 square meters of workshop and several integral production lines ,guarantee the supply of mass production
●Excellent team——More than 290 employees, more than 50 engineers, including 5 researchers ,36 engineers and 13 senior engineers to provide professional design and technical support for our customs.
●Extensive product range——The main products are HTCC, LTCC, and ALN ceramic package and substrate,production covering many series as optical communication module package, power laser package, microwave device packaging, high-density integrated circuit packaging , ALN substrate products and other fields of package.Products include optical series, aluminum nitride products, LED package; microwave package series and IC series, to satisfy the individuating demands of our customers.
To be devoted and concentrated，is the tenet of SINOPACK. Committed to doing a good job for the ceramic package , efforts to build a high quality brand image; with sincere heart to provide the highest quality products and the most satisfactory service is our perpetual pursuit.We would like to make our humble effort to develop together with customers.

Sinopack main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains such as optical communication module packaging, power laser package, microwave device package, high-density integrated circuit package, ALN substrate products and other fields of package.

Sinopack has a background in ceramic packaging for more than 40 years and yet continuous to innovate by constant investment of capital in R&D and manufacturing of multilayer ceramic packages.