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- Description -

Seminex Corporation

Seminex is a specialist manufacturer of high-performance InP (Indium Phosphide) laser diodes and Semiconductor Optical Amplifiers (SOAs), operating across the critical mid-infrared spectrum from 1250 nm to 2400 nm. We engineer robust, high-powered semiconductor-based devices that drive innovation in demanding fields.Our product portfolio is tailored for high-stakes applications, including LiDAR, medical procedures, defense systems, and quantum technology.Seminex offers a wide variety of high-power components and flexible integration options. Our laser diode devices span the 1300nm to 1940nm range and are precisely fiber-coupled into various core sizes (50µm, 100µm, or 200µm). Key product technologies include Fiber Perot lasers, ultra-high peak power Triple Junction diodes (up to 100W peak at 1500nm), High Gain SOAs, and high-coherence High Power DFB lasers.We also supply complete Laser Engines and offer components in diverse packaging formats, such as B-Mount, C-Mount, TO9, TO56, CoC, Butterfly, Multi Chip Modules (MCM), Chips, and XCM, providing maximum flexibility for integration into client systems.
Seminex is a specialist manufacturer of high-performance InP (Indium Phosphide) laser diodes and Semiconductor Optical Amplifiers (SOAs), operating across the critical mid-infrared spectrum from 1250 nm to 2400 nm. We engineer robust, high-powered semiconductor-based devices that drive innovation in demanding fields.Our product portfolio is tailored for high-stakes applications, including LiDAR, medical procedures, defense systems, and quantum technology.Seminex offers a wide variety of high-power components and flexible integration options. Our laser diode devices span the 1300nm to 1940nm range and are precisely fiber-coupled into various core sizes (50µm, 100µm, or 200µm). Key product technologies include Fiber Perot lasers, ultra-high peak power Triple Junction diodes (up to 100W peak at 1500nm), High Gain SOAs, and high-coherence High Power DFB lasers.We also supply complete Laser Engines and offer components in diverse packaging formats, such as B-Mount, C-Mount, TO9, TO56, CoC, Butterfly, Multi Chip Modules (MCM), Chips, and XCM, providing maximum flexibility for integration into client systems.